職責描述：
1. New wafer plating process development.
2. Wafer chemical plating process control and improvement.
3. Wafer plating related trouble shooting.
4. Wafer Plating related quality control.
任職要求：
1.Bachelor above degree of chemical science/engineering
2.More than 5 years experience in semiconductor industry, preferably to have wafer plating/EL-plating engineering related working experience at wafer fab.
3.Analytical, problem solving and troubleshooting skills.
- Wafer Plating Process Knowledge
- Fab process knowledge
- Communication Skill
- Project Management

Agape Package Manufacturing (Shanghai) Ltd. is a wholly owned subsidiary of AOS established in Dec. 2004. Our company is located in Songjiang Export Process Area (B area), covering an area of 17028 square meters, with registered capital 38 million dollars and a total investment of 84 million dollars. APM has made profits since the fourth season in 2005. APM is engaged in semi-conductor assembly and testing and its products are widely used in customer electronics area.
Since the establishment, our company has aimed at being the world-best simulating circuit package and manufacturing enterprise, satisfying and exceeding customers' expectation via excellent products and service. Presently APM is at fast-growing stage with its achievements flourishing and has a wide developing prospect.

葵和精密電子（上海）有限公司（APM）成立于2004年12月，系萬代半導體全資子公司。公司位于上海市松江出口加工區B區東開置業園B1棟標準廠房，占地面積：17028平方，注冊資本為3800萬美元，總投資額達8398萬美元，于2005年第四季度開始盈利。公司從事半導體封裝和測試，產品主要用于消費類電子產品領域。
公司自創立之始就以成為世界第一的模擬電路封裝制造企業為目標，通過杰出的產品和服務不斷滿足和超越顧客期望。目前，公司正處于快速成長期，業績蒸蒸日上，擁有廣闊的發展前景。
吸引人才，重視人才是葵和精密電子（上海）有限公司的一貫宗旨，我們相信葵和是一個實現夢想的地方，是有志有識之士有所作為的企業。公司提供具有競爭力的薪資福利待遇、良好的培訓機會和晉升的機會。另外，公司提供上下班班車到莘莊、中山公園、浦東、嘉定、松江等各區。
我們誠摯地期待著您加入我們的行列。公司將秉承“以人為本”的管理理念，努力營造和諧的工作氛圍，為每位員工提供發揮才華的舞臺。
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